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  5. Ic & Component Sockets Sn-Au Series 5 W/H Miniature Spring

This item is Discontinued.

Te Connectivity Ic & Component Sockets Sn-Au Series 5 W/H Miniature Spring 5050871-1

Ic & Component Sockets Sn-Au Series 5 W/H Miniature Spring (Discontinued)

  • Mfr # 5050871-1
  • Zoro # G705995325
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Specifications

Product Information

MFR #
5050871-1
Zoro #
G705995325
UPC #
-
Country of Origin
United States

Dimensions

Contact Spring Plating Thickness
30 µin
PCB Thickness (Recommended)
.031 to .125 in
Wire/Cable Size
18 to 17 AWG
Hole Size (Recommended)
.101 in
Mating Pin Diameter Range
.042 to .049 in
Contact Mating Area Plating Thickness
30 µin
Socket Length
.288 in

Details

Operating Temperature Range
-65 to 125 °C
Connector System
Cable-to-Board
Sleeve Style
Open Bottom
Termination Method to Wire & Cable
Solder
Contact Type
Socket
Contact Spring Plating Material
Gold
Circuit Application
Power & Signal
Spring Material
Beryllium Copper
Connector & Contact Terminates To
Printed Circuit Board
Product Type
Contact
Contact Current Rating (Max)
7.5 A
Contact Transmits (Typical)
Signal (Data)/Power
Wire/Cable Type
Discrete Wire
Sleeve Plating Material
Tin
Profile
Zero
Socket Type
Discrete
Sleeve Material
Copper
Contact Base Material
Beryllium Copper
Insertion Method
Hand/Semi-Automatic
Termination Method to Printed Circuit Board
Through Hole - Press-Fit

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